A Guide to Printed Circuit Board Design by Charles Hamilton

By Charles Hamilton

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Extra resources for A Guide to Printed Circuit Board Design

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This will be bound to net any serious defects and will give the designer and the company concerned the confidence to proceed with large-quantity orders if so required. For method of generating CAD master patterns refer to Chapter 5. Other master artworks which may be required at the final stages of the board's development and prior to issuing for pilot production quantities are: Solder side resist master. Component side resist master. Legend/coding master. 46 A guide to printed circuit board design Solder side resist master The solder resist (ink) screen process is required on the solder side of the board primarily to prevent solder 'bridging' across adjacent conductors.

If the artwork is eventually to be CAD-generated, then the designer must ensure that the taped artwork pad is compatible with the pads on the computer disc file. ). B 0,21 MANUF PROCESS ALLOWANCE X 2 = 0,42mm *"1P . 1 Pad d i a m e t e r c a l c u l a t i o n While the designer is placing the pads, he should be aware and looking continuously for conditions where the design minima cannot be achieved. OlOin). 014in) is obtained. This is a design minimum on the artwork at 1:1. 056in) at 4:1 scale.

When the layout is finally approved and the master taped artworks modified, they can be held for pilot production quantities, if required. The layout can then be digitised and CAD artworks produced prior to issuing for main production quantities. , as described earlier in this chapter. However, it is recognised that it is extremely difficult and timeconsuming to try and establish full compatibility in all essential areas of the board design. Therefore, in these cases the best course of action to adopt is to have a small quantity of boards made from the final CAD artworks, which are then built and tested to factory standards.

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