Adaptive Cooling of Integrated Circuits Using Digital by Krishnendu Chakrabarty, Visit Amazon's Philip Y. Paik Page,

By Krishnendu Chakrabarty, Visit Amazon's Philip Y. Paik Page, search results, Learn about Author Central, Philip Y. Paik, , Vamsee K. Pamula

Due to expanding energy intake and part density, localized "hot spots" have gotten a major problem in IC (integrated circuit) chip layout - so severe, actually, that Intel lately needed to yank a circuit since it used to be actually burning. For IC engineers grappling with excessive strength dissipation and thermal concerns, new droplet-based cooling suggestions utilizing electronic microfluidics know-how may supply the answer. This definitive consultant paves the way in which, with layout and implementation methodologies and prototypes for using this groundbreaking know-how. After reviewing cooling rules and present bulk cooling tools, the e-book brings engineers on top of things on rising droplet-based architectures. Amply illustrated, this milestone paintings will turn out necessary in tackling IC warmth concerns that current equipment can not handle.

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Extra resources for Adaptive Cooling of Integrated Circuits Using Digital Microfluidics

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Since a large number of droplets can be transported in user-defined patterns over a two-dimensional array of electrodes, a variety of flow paths for optimal cooling can be programmed, depending on the thermal profile of the IC. These thermal profiles can be either obtained in advance, or determined in real time via a thermal feedback mechanism. 12. , their effective flow rates) can be varied, adding an extra degree of controllability. This on the fly reconfigurability inherent to digital microfluidics enables us to create an adaptive cooling platform.

One method is to continually dispense and transport cooled droplets across the surface of an IC, whereby the droplets transfer, store, and carry heat away from the IC substrate to a cooling reservoir. Once the droplet has cooled, it can be redispensed to repeat the cooling process. 11 shows schematic top and Adaptive Hot-Spot Cooling Principles and Design 61 side views of this flow-through cooling method. The system consists of reservoirs of liquid sandwiched between a bottom microfluidic chip and a top plate.

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